• DocumentCode
    636787
  • Title

    Multi-level 3D implementation of thermo-pneumatic pumping on centrifugal microfluidic CD platforms

  • Author

    Thio, Tzer Hwai Gilbert ; Ibrahim, Fatimah ; Al-Faqheri, Wisam ; Soin, Norhayati ; Bador Abdul Kahar, Maria Kahar ; Madou, Marc

  • Author_Institution
    Dept. of Biomed. Eng., Univ. of Malaya, Kuala Lumpur, Malaysia
  • fYear
    2013
  • fDate
    3-7 July 2013
  • Firstpage
    5513
  • Lastpage
    5516
  • Abstract
    Thermo-pneumatic (TP) pumping is a method employing the principle of expanding heated air to transfer fluids back towards the CD center on the centrifugal microfluidic CD platform. While the TP features are easy to fabricate as no moving parts are involved, it consumes extra real estate on the CD, and because heating is involved, it introduces unnecessary heating to the fluids on the CD. To overcome these limitations, we introduce a multi-level 3D approach and implement forced convection heating. In a multi-level 3D CD, the TP features are relocated to a separate top level, while the microfluidic process remains on a lower bottom level. This allows for heat shielding of the fluids in the microfluidic process level, and also improve usage of space on the CD. To aid in future implementations of TP pumping on a multi-level 3D CD, studies on the effect of heat source setting, and the effect of positioning the TP feature (it distance from the CD center) on CD surface heating are also presented. In this work, we successfully demonstrate a multi-level 3D approach to implement TP pumping on the microfluidic CD platform.
  • Keywords
    microfluidics; micropumps; patient diagnosis; pneumatic systems; CD center; CD surface heating; centrifugal microfluidic CD platforms; compact disc; forced convection heating; heat shielding; microfluidic process; multilevel 3D CD; thermopneumatic pumping; Heat pumps; Liquids; Microfluidics; Space heating; Temperature measurement; Three-dimensional displays;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
  • Conference_Location
    Osaka
  • ISSN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/EMBC.2013.6610798
  • Filename
    6610798