DocumentCode
636895
Title
Does 3D produce more symptoms of visually induced motion sickness?
Author
Naqvi, Syed Ali Arsalan ; Badruddin, Nasreen ; Malik, A.S. ; Hazabbah, Wan ; Abdullah, Baharudin
Author_Institution
Dept. of Electr. & Electron. Eng., Univ. Teknol. PETRONAS, Tronoh, Malaysia
fYear
2013
fDate
3-7 July 2013
Firstpage
6405
Lastpage
6408
Abstract
3D stereoscopy technology with high quality images and depth perception provides entertainment to its viewers. However, the technology is not mature yet and sometimes may have adverse effects on viewers. Some viewers have reported discomfort in watching videos with 3D technology. In this research we performed an experiment showing a movie in 2D and 3D environments to participants. Subjective and objective data are recorded and compared in both conditions. Results from subjective reporting shows that Visually Induced Motion Sickness (VIMS) is significantly higher in 3D condition. For objective measurement, ECG data is recorded to find the Heart Rate Variability (HRV), where the LF/HF ratio, which is the index of sympathetic nerve activity, is analyzed to find the changes in the participants´ feelings over time. The average scores of nausea, disorientation and total score of SSQ show that there is a significant difference in the 3D condition from 2D. However, LF/HF ratio is not showing significant difference throughout the experiment.
Keywords
data recording; electrocardiography; medical disorders; medical image processing; neurophysiology; stereo image processing; visual perception; 2D environments; 3D environments; 3D stereoscopy technology; ECG data recording; HRV; LF-HF ratio; adverse effects; depth perception; heart rate variability; high quality images; nausea; sympathetic nerve activity; video watching; visual induced motion sickness; Electrocardiography; Fatigue; Hafnium; Heart rate variability; Motion pictures; Three-dimensional displays; Visualization;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
Conference_Location
Osaka
ISSN
1557-170X
Type
conf
DOI
10.1109/EMBC.2013.6611020
Filename
6611020
Link To Document