• DocumentCode
    638355
  • Title

    Assessment of silver nanoparticle inkjet-printed microstrip lines for RF and microwave applications

  • Author

    Camarchia, Vittorio ; Chiolerio, Alessandro ; Cotto, M. ; Fang, Jianwu ; Ghione, G. ; Pandolfi, P. ; Pirola, Marco ; Quaglia, R. ; Ramella, C.

  • Author_Institution
    DET, Politec. di Torino, Turin, Italy
  • fYear
    2013
  • fDate
    14-18 April 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The paper describes the fabrication process, the technology assessment and the experimental characterization of silver nanoparticle inkjet-printed microstrip structures on alumina substrates for RF and microwave applications. The present technology allows, through the adoption of innovative silver-based inks and a special piezoelectric-inkjet printer, the direct printing of microstrip prototypes on alumina substrates. The electrical characteristics of the manufactured strips have been modeled, starting from measured data, and several samples of line-stub impedance matching sections have been realized and measured to verify the repeatability of the line characteristic and printing alignment accuracy. More complex structures, including soldered components and ground wrap-around connection, have been realized and tested, showing good agreement between simulations and measurements.
  • Keywords
    ink jet printing; microstrip lines; microwave circuits; nanofabrication; nanoparticles; silver; Ag; Al2O3; RF applications; alumina substrates; direct printing; ground wrap-around connection; line-stub impedance matching sections; microwave applications; piezoelectric-inkjet printer; silver nanoparticle inkjet-printed microstrip lines; soldered components; Microstrip; Microwave circuits; Printing; Radio frequency; Substrates; Transmission line measurements; Microstrip filters; inkjet printing; nanoparticles; prototypes; transmission line measurements;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wireless Symposium (IWS), 2013 IEEE International
  • Conference_Location
    Beijing
  • Type

    conf

  • DOI
    10.1109/IEEE-IWS.2013.6616731
  • Filename
    6616731