Surface charge decay on HVDC insulators: Temperature and Field effects

Author

Gremaud, R. ; Bjelogrlic, M. ; Schneider, Markus ; Logakis, E. ; Schlegel, Christian ; Fursich, S. ; Krivda, A. ; Christen, Thomas ; Riechert, U.

Author_Institution

Corp. Res., ABB Switzerland Ltd., Baden-Dättwil, Switzerland

fYear

2013

fDate

June 30 2013-July 4 2013

Firstpage

1056

Lastpage

1059

Abstract

The surface charge behavior on epoxy plates pre-charged by corona in SF₆ is investigated by surface potential decay measurements. The temperature dependence of the charge mobility estimated from surface potential decay is compared to the DC volume conductivity obtained from conventional current-voltage measurements. Furthermore, the effect of the temperature and the initial field on the charge decay mechanisms is studied. This is of particular practical importance for applications because considerable temperature gradients along the epoxy insulators in gas-insulated switchgears (GIS) separating the hot conductor from the cold ground can appear. Different surface charge controlling mechanisms may predominate at different locations on a GIS insulator.

Keywords

HVDC power transmission; SF₆ insulation; electrical conductivity; epoxy insulation; gas insulated switchgear; insulators; DC volume conductivity; GIS insulator; HVDC insulators; SF₆; charge decay mechanisms; charge mobility; cold ground; corona; current- oltage measurements; epoxy insulators; epoxy plates; field effects; gas-insulated switchgears; hot conductor; initial field; surface charge behavior; surface charge controlling mechanisms; surface charge decay; surface potential decay; surface potential decay measurements; temperature dependence; temperature effects; temperature field; temperature gradients; Electric potential; Insulators; Probes; Surface charging; Surface treatment; Temperature measurement; Voltage measurement; HVDC; epoxy; gas insulated switchgear (GIS); surface potential decay;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid Dielectrics (ICSD), 2013 IEEE International Conference on

Conference_Location

Bologna

ISSN

2159-1687

Print_ISBN

978-1-4799-0807-3

Type

conf

DOI

10.1109/ICSD.2013.6619685

Filename

6619685