• DocumentCode
    639710
  • Title

    Electric field distribution calculation and analysis on the surface of jumper on double circuit transposition tower in UHV AC transmission lines

  • Author

    Xi Yang ; Zongren Peng ; Naiyi Li ; Haohui Cai ; Shiling Zhang ; Jintao Liao

  • Author_Institution
    State Key Lab. of Electr. Insulation & Power Equip., Xi´an Jiaotong Univ., Xi´an, China
  • fYear
    2013
  • fDate
    June 30 2013-July 4 2013
  • Firstpage
    202
  • Lastpage
    205
  • Abstract
    The structure of double circuit transposition tower in 1000 kV ultra-high voltage (UHV) AC transmission lines is complex and it has various types of jumper. The electric field distribution on the surface of jumper is higher and more uneven when compared to ordinary tension tower. With three dimensional finite element method (FEM) and harmonic analysis, the electric field distribution on the surface of jumper was calculated when considering the effect of tower, fittings, insulator strings and phase influence, the regularity of electric field distribution on jumper were researched and the jumper that didn´t meet the electric field standard was optimized. The achievements obtained in this paper will be used in UHV project and relieve the problem of audible noise and radio and television interference.
  • Keywords
    electric fields; finite element analysis; harmonic analysis; poles and towers; power transmission lines; FEM; UHV AC transmission lines; UHV project; audible noise; double circuit transposition tower; electric field distribution calculation; harmonic analysis; insulator strings; jumper surface analysis; radio interference; television interference; tension tower; three dimensional finite element method; voltage 1000 kV; Conductors; Electric fields; Finite element analysis; Integrated circuit modeling; Optimization; Poles and towers; Power transmission lines; electric field distribution; finite element method(FEM); jumper; transposition tower; ultra-high voltage(UHV) AC;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid Dielectrics (ICSD), 2013 IEEE International Conference on
  • Conference_Location
    Bologna
  • ISSN
    2159-1687
  • Print_ISBN
    978-1-4799-0807-3
  • Type

    conf

  • DOI
    10.1109/ICSD.2013.6619912
  • Filename
    6619912