Title :
Table of contents
Abstract :
The following topics are dealt with: ATE; test data mining; 2.5D-3D-IC DFT; scan compression; 3D-TSV testing; SoC testing; protocols; test generation; board test methods; ADC; aging; FPGA; advanced measurement techniques; hardware security; HF signal test methods; on-chip monitoring and sensing; and system-level test equipment.
Keywords :
ageing; analogue-digital conversion; automatic test equipment; data compression; data mining; design for testability; integrated circuit measurement; integrated circuit testing; protocols; signal processing; system-on-chip; three-dimensional integrated circuits; 2.5D-3D-IC DFT; 3D-TSV testing; ADC; ATE; FPGA; HF signal test methods; SoC testing; advanced measurement techniques; aging; board test methods; hardware security; on-chip monitoring; on-chip sensing; protocols; scan compression; system-level test equipment; test data mining; test generation;
Conference_Titel :
Test Conference (ITC), 2013 IEEE International
Conference_Location :
Anaheim, CA
DOI :
10.1109/TEST.2013.6651864
