DocumentCode
642628
Title
Dynamic electrothermal macromodeling techniques for thermal-aware design of circuits and systems
Author
Magnani, A. ; d´Alessandro, Vincenzo ; Rinaldi, Niccolo ; de Magistris, M. ; Aufinger, Klaus
Author_Institution
Dept. of Electr. Eng. & Inf., Univ. Federico II, Naples, Italy
fYear
2013
fDate
9-11 Sept. 2013
Firstpage
227
Lastpage
230
Abstract
The applicability of classical macromodeling techniques to dynamic electrothermal analysis is reviewed, with emphasis on specific aspects of the Fourier heat conduction problem. Modeling based on the characterization of thermal multiports is considered, and the identification of corresponding thermal impedances in frequency and time domain is discussed, along with the synthesis of electrical equivalents well suited for standard circuit simulators like SPICE. The presented approach is illustrated through relevant case-studies, namely, two basic analog electronics circuits in state-of-the-art bipolar technologies.
Keywords
bipolar analogue integrated circuits; circuit simulation; equivalent circuits; heat conduction; integrated circuit design; integrated circuit modelling; multiport networks; thermal management (packaging); time-domain synthesis; Fourier heat conduction problem; SPICE circuit simulators; analog electronics circuits; dynamic electrothermal macromodeling techniques; electrical equivalents synthesis; frequency domain; state-of-the-art bipolar technologies; thermal impedances; thermal multiports; thermal-aware design; time domain; Finite element analysis; Impedance; Resistance heating; Silicon germanium; Standards; Thermal conductivity; compact thermal modeling; electrical macromodeling; silicon germanium (SiGe); silicon on glass (SOG); thermal feedback; thermal impedance;
fLanguage
English
Publisher
ieee
Conference_Titel
Power and Timing Modeling, Optimization and Simulation (PATMOS), 2013 23rd International Workshop on
Conference_Location
Karlsruhe
Type
conf
DOI
10.1109/PATMOS.2013.6662178
Filename
6662178
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