Modelling of Reliability by Highly Accelerated Characterization Method for Solid State Lighting LED Boards

Main goal of the work presented in this paper is modeling of reliability and development of an innovative fast accelerated LED board validation method based on mechanical cycling which may replace currently used thermal cycling test. The paper discusses the design of new LED board 3-D models for reliability simulation. Reliability calculation is based on thermal or mechanical cycling using constructive equation for creep modeling and FEM thermo-mechanical elastic-plastic simulation. The simulation results were verified on newly developed testing facilities.