• DocumentCode
    644035
  • Title

    Comparative Analysis: Power Reversible Comparator Circuits 90 Nm Technology

  • Author

    Khurana, S. ; Grover, Anuj ; Grover, Neeti

  • Author_Institution
    ECE, SBSSTC, Ferozepur, India
  • fYear
    2013
  • fDate
    23-25 July 2013
  • Firstpage
    103
  • Lastpage
    107
  • Abstract
    In this paper we design GDI and TG based Reversible Comparator circuit using 90 nm Technology. Reversible or information loss less circuits have applications in nanotechnology, digital signal processing, communication, computer graphics and cryptography. They are also a fundamental requirement in the emerging field of quantum computing. Reversible gates are evaluated in terms of number of transistor count, critical path, garbage outputs and one to one mapping. Here transistor implementation of the reversible gates is done by using a combination CMOS-GDI circuit, TG Circuits, which provides the optimal solution for combinational logic, saving 1/3 the power, half the area and 10% in delay relative to a CMOS implementation. GDI circuits provide some measure of enhanced hazard tolerance and are more suitable for low voltage operation. Here transistor implementation of reversible gates is done by using Tanner tools and H-spice tools. Since the proposed work is explored for the first time ever in literature, the contribution of this paper will create a new thread of research in the area of reversible logic circuit.
  • Keywords
    CMOS logic circuits; SPICE; combinational circuits; comparators (circuits); CMOS; H-spice tools; Tanner tools; combinational logic; gate diffusion input comparator; low voltage operation; power reversible comparator circuits; reversible gates; size 90 nm; transmission gate technology comparator; CMOS integrated circuits; CMOS technology; Delays; Educational institutions; Logic gates; Transistors; Very large scale integration; Gate Diffusion Input (GDI); Transmission Gate Technology (TG) Comparator;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Modelling Symposium (AMS), 2013 7th Asia
  • Conference_Location
    Hong Kong
  • Type

    conf

  • DOI
    10.1109/AMS.2013.21
  • Filename
    6664677