• DocumentCode
    64570
  • Title

    Call for papers: Advanced manufactring of wide band gap (WBG) semiconductor products

  • Volume
    60
  • Issue
    6
  • fYear
    2013
  • fDate
    Jun-13
  • Firstpage
    2091
  • Lastpage
    2091
  • Abstract
    A Special Section in the IEEE Transactions on Semiconductor Manufacturing, May 2014: After nearly three decades of research and development, wide band gap semiconductors (e.g. SiC and GaN) are ripe for high-volume applications in power electronics, communication, sensors, solid-state lighting, and photovoltaics. However, there are significant manufacturing challenges that must be overcome before large-scale manufacturing can take place. Fundamental issues pertaining to high defect density in the material, proper yield estimation and metrology techniques, and focus on "applications-driven" manufacturing are essential in order to advance the manufacturing of wide band gap (WBG) semiconductors. The IEEE Transactions on Semiconductor Manufacturing solicits original papers addressing the challenges and opportunities in manufacturing ofWBG semiconductor devices. Deadline for Receipt of Papers is July 31, 2013.
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2013.2263742
  • Filename
    6516924