• DocumentCode
    646704
  • Title

    A hybrid method combining static and full wave techniques to solve conducted emissions problems

  • Author

    Mologni, J.F. ; Eguni, G. ; Siqueira, C.L.R. ; Kopp, M. ; Alves, M.A.R.

  • Author_Institution
    Electron. Design Autom. Dept., ESSS / ANSYS, Sao Paulo, Brazil
  • fYear
    2013
  • fDate
    5-9 Aug. 2013
  • Firstpage
    277
  • Lastpage
    281
  • Abstract
    Frequency dependent models are required to address most of the conducted emissions problems when any circuit or system simulator is used. High frequency 3D full wave solvers are often employed to extract S parameters from passive components, generating a frequency dependent model, which in this case, is known as a Touchstone file format. This extraction process uses a numerical technique to solve the complete set of Maxwell´s equation for higher frequencies and then extrapolates the results at DC. This work presents a methodology that uses a static solver to actually calculate the DC resistance at 0Hz, yielding a more accurate S parameter matrix of the model. A commercial washing machine is used as an example for a conducted emissions analysis (according to CISPR 14-1). Measurements results are also presented, showing a reasonably good match with the proposed technique.
  • Keywords
    Maxwell equations; electronic engineering computing; extrapolation; matrix algebra; simulation; washing machines; Maxwell equation; S parameter matrix; Touchstone file format; commercial washing machine; conducted emissions analysis; emissions problems; extraction process; frequency dependent models; full wave techniques; high frequency 3D full wave solvers; numerical technique; passive components; static solver; static techniques; system simulator; Finite element analysis; Integrated circuit modeling; Mathematical model; Resistance; Scattering parameters; Transmission line matrix methods; Washing machines;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility (EMC), 2013 IEEE International Symposium on
  • Conference_Location
    Denver, CO
  • ISSN
    2158-110X
  • Print_ISBN
    978-1-4799-0408-2
  • Type

    conf

  • DOI
    10.1109/ISEMC.2013.6670423
  • Filename
    6670423