• DocumentCode
    646759
  • Title

    A new design flow to evaluate high-speed SerDes link performance with re-driver

  • Author

    Chunfei Ye ; Xiaoning Ye ; Yinglei Ren ; Kai Xiao ; Argueta, Odilon ; Peterson, N.

  • Author_Institution
    DCSG, Intel Corp., DuPont, WA, USA
  • fYear
    2013
  • fDate
    5-9 Aug. 2013
  • Firstpage
    575
  • Lastpage
    580
  • Abstract
    Due to non-LTI behaviour of re-driver, simulation methodology and model format are still working in progress for continuous improvement on accuracy and efficiency to perform statistical analysis such as BER for high-speed serial IO links. In this paper, a measurement based methodology is proposed and introduced to provide a flow and methodology to evaluate re-driver link performance. The methodology is based on re-driver assessment board to obtain reference channel through measurement by meeting industry IO specifications. Channel Quality Comparison (CQC) is then introduced and used to evaluate risk level of the proposed design topology by benchmarking to the reference channels. Design engineers can use the flow and methodology introduced in this paper to evaluate link performance for their proposed topology in addition to using simulation. A design example on test platform for USB3 is reported to demonstrate the usage with measurement results.
  • Keywords
    active networks; printed circuits; risk analysis; statistical analysis; BER; CQC; USB3 test platform; active component; channel quality comparison; design flow; high-speed SerDes link performance evaluation; high-speed serial IO links; measurement based methodology; nonLTI behaviour; re-driver assessment board; re-driver link performance evaluation; reference channel; risk level evaluation; statistical analysis; Analytical models; Bit error rate; Connectors; Performance evaluation; Routing; Silicon; Topology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility (EMC), 2013 IEEE International Symposium on
  • Conference_Location
    Denver, CO
  • ISSN
    2158-110X
  • Print_ISBN
    978-1-4799-0408-2
  • Type

    conf

  • DOI
    10.1109/ISEMC.2013.6670478
  • Filename
    6670478