• DocumentCode
    649485
  • Title

    Analysis of the effectiveness of core swapping in modern multicore processors

  • Author

    Zajac, Piotr ; Szermer, Michal ; Janicki, Marcin ; Maj, Cezary ; Pietrzak, P. ; Napieralski, A.

  • Author_Institution
    Dept. of Microelectron. & Comput. Sci., Lodz Univ. of Technol., Lodz, Poland
  • fYear
    2013
  • fDate
    25-27 Sept. 2013
  • Firstpage
    385
  • Lastpage
    388
  • Abstract
    One of the interesting thermal management techniques for multi-core processors is core swapping. In this paper, using the published power data and floorplans for two modern high-performance processors, we employ the well-known HotSpot tool to perform the thermal simulation of the core swapping mechanism. Our transient simulations show that by using core swapping technique, it was possible to either minimize the hot spot temperature in the Ivy Bridge chip by 5°C or increase the operating frequency by 17% and maintain the same temperature as in the case without core swapping. We also derive an analytical model of the activity migration mechanism between two cores which may serve as a tool to calculate the swapping frequency given the desired maximal temperature drop. The model also allows for the correlation of the cooling effectiveness with the performance penalty induced by the swapping.
  • Keywords
    microprocessor chips; thermal management (packaging); HotSpot tool; Ivy Bridge chip; activity migration mechanism; core swapping mechanism; floorplans; multicore processors; published power data; swapping frequency; thermal management techniques; thermal simulation; transient simulations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal Investigations of ICs and Systems (THERMINIC), 2013 19th International Workshop on
  • Conference_Location
    Berlin
  • Print_ISBN
    978-1-4799-2271-0
  • Type

    conf

  • DOI
    10.1109/THERMINIC.2013.6675178
  • Filename
    6675178