DocumentCode
649494
Title
[Front cover]
fYear
2013
fDate
25-27 Sept. 2013
Abstract
Presents the front cover of this proceedings volume.
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal Investigations of ICs and Systems (THERMINIC), 2013 19th International Workshop on
Conference_Location
Berlin, Germany
Print_ISBN
978-1-4799-2271-0
Type
conf
DOI
10.1109/THERMINIC.2013.6675187
Filename
6675187
Link To Document