The nondestructive thermoacoustic method of determination of the air-tightness of metal packagings of transistors

Author

Kubicki, M. ; Malmski, Miroslaw

Author_Institution

Dept. of Electron. & Comput. Sci., Koszalin Univ. of Technol., Koszalin, Poland

fYear

2013

fDate

25-27 Sept. 2013

Firstpage

21

Lastpage

26

Abstract

The paper presents a new, nondestructive method of determination of the air-tightness of metal packagings of transistors. This method is based on the thermoacoustic approach with a microphone detection. Thermoacoustic approach means that the sound is generated by the periodical temperature of the element caused by the periodical electric power dissipation in it. In the paper both the experimental thermoacoustic frequency characteristics as also the theoretical approach applied for numerical interpretations of experimental data are presented and discussed.

Keywords

acoustic applications; microphones; nondestructive testing; semiconductor device packaging; transistors; air-tightness determination; metal packagings; microphone detection; nondestructive thermoacoustic method; periodical electric power dissipation; thermoacoustic frequency characteristics; transistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal Investigations of ICs and Systems (THERMINIC), 2013 19th International Workshop on

Conference_Location

Berlin

Print_ISBN

978-1-4799-2271-0

Type

conf

DOI

10.1109/THERMINIC.2013.6675240

Filename

6675240