DocumentCode
650010
Title
Methodology for thermal diffusivity determination of metallic films at room temperature
Author
Lugo, J.M. ; Corona, J.E. ; Oliva, A.I.
Author_Institution
Dept. of Fis. Aplic., Centro de Investig. y de Estudios Av. del IPN, Merida, Mexico
fYear
2013
fDate
Sept. 30 2013-Oct. 4 2013
Firstpage
375
Lastpage
379
Abstract
An analytical model and a methodology for thermal diffusivity determination of metallic thin films at atmospheric pressure and room temperature are discussed. The analytical model is based on the one-dimensional heat conduction equation which allows us to estimate the thermal diffusivity value through the initial heating slope. To determine the thermal diffusivity value of metallic nanofilms, controlled micropulses were applied on them in order to measure changes in the electrical resistance and to estimate the corresponding changes of temperature in the transitory regime, where only the metallic film is heated. The proposed analytical model and the methodology were used to characterize Au and Al thin films thermally deposited on glass substrates. Preliminary results gave thermal diffusivity values of (40 ± 4) × 10-6 m2/s for an Au(40 nm) film, and (25 ± 3) ±10-6 m2/s for an Al(40 nm) film at room conditions (298 K, and atmospheric pressure).
Keywords
aluminium; electric resistance; gold; metallic thin films; nanostructured materials; thermal diffusivity; 1D heat conduction equation; Al; Al thin film; Au; Au thin film; analytical model; controlled micropulses; electrical resistance; glass substrates; initial heating slope; metallic nanofilms; metallic thin films; pressure 1 atm; size 40 nm; temperature 293 K to 298 K; temperature changes; thermal diffusivity determination; transitory regime; metallic film; micropulse; temperature profile; thermal diffusivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Engineering, Computing Science and Automatic Control (CCE), 2013 10th International Conference on
Conference_Location
Mexico City
Print_ISBN
978-1-4799-1460-9
Type
conf
DOI
10.1109/ICEEE.2013.6676041
Filename
6676041
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