DocumentCode :
651513
Title :
A CMOS micromachined capacitive tactile sensor with compensation of process variations
Author :
Hao-Cheng Tsai ; Tien-Keng Wu ; Tsung-Heng Tsai
Author_Institution :
Dept. of Electr. Eng., Nat. Chung Cheng Univ., Chiayi, Taiwan
fYear :
2013
fDate :
Oct. 31 2013-Nov. 2 2013
Firstpage :
342
Lastpage :
345
Abstract :
This paper presents a standard-CMOS-fabricated capacitive tactile sensor with high sensitivity and a sensing circuit with compensation of process variations. Both of the sensor and sensing circuit are fabricated on a single chip by a TSMC 0.35μm CMOS MEMS technology. In order to create high sensitivity of the sensor for sensing circuit, a T-shaped protrusion is proposed. This sensor is constituted by the metal layer and the dielectric layer without extra thin film deposition, and can be completed with few simple post-processing steps. With the fully differential correlated double sampling capacitor-to-voltage converter (CDS-CVC) and reference capacitor correction, process variations are compensated. The measured sensitivity of the sensing circuit is 18mV/fF.
Keywords :
CMOS integrated circuits; bioMEMS; biomedical electronics; biomedical equipment; capacitive sensors; capacitors; dielectric thin films; metallic thin films; micromachining; microsensors; tactile sensors; thin film sensors; CMOS micromachined capacitive tactile sensor; T-shaped protrusion; TSMC CMOS MEMS technology; chip; dielectric layer; differential correlated double sampling capacitor-to-voltage converter; metal layer; process variation compensation; reference capacitor correction; sensing circuit; standard-CMOS-fabricated capacitive tactile sensor; Capacitance; Capacitors; Electrodes; Sensitivity; Tactile sensors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Biomedical Circuits and Systems Conference (BioCAS), 2013 IEEE
Conference_Location :
Rotterdam
Type :
conf
DOI :
10.1109/BioCAS.2013.6679709
Filename :
6679709
Link To Document :
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