• DocumentCode
    653355
  • Title

    A New Method of Designing High-Power Electroplating Power Supply

  • Author

    YiHong He ; Shuiyong Yu

  • Author_Institution
    Inf. Eng. Coll., WuYi Univ., Jiangmen, China
  • fYear
    2013
  • fDate
    20-23 Aug. 2013
  • Firstpage
    1429
  • Lastpage
    1433
  • Abstract
    With the development of power electronics technology, people are attaching great attention to the efficiency of power supply and power quality. Aiming at lots of harmonics which high-power electroplating power supply produced in the grid side, low power factor and much energy loss are also serious problem. The three-level PWM rectifier technology is applied to high-power electroplating power supply occasion in this paper. Designed a double closed loop control system which contains voltage outer loop and current inner loop. A new simulation model has been established based on Matlab/Simulink. The scheme is proved to be effective, available and achieved the goal of unit power factor operation, less harmonics, high efficiency.
  • Keywords
    PWM rectifiers; closed loop systems; control system synthesis; electric current control; electroplating; power factor; power grids; power supplies to apparatus; power supply quality; power system harmonics; voltage control; Matlab-Simulink simulation; current inner loop; double closed loop control system; energy loss; harmonics grid side; high-power electroplating power supply; power electronics technology; power factor operation; power quality; three-level PWM rectifier technology; voltage outer loop; Harmonic analysis; Power supplies; Power system harmonics; Pulse width modulation; Reactive power; Rectifiers; Voltage control; efficiency; harmonics; high-power electroplating power supply; three-level PWM rectifier;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Green Computing and Communications (GreenCom), 2013 IEEE and Internet of Things (iThings/CPSCom), IEEE International Conference on and IEEE Cyber, Physical and Social Computing
  • Conference_Location
    Beijing
  • Type

    conf

  • DOI
    10.1109/GreenCom-iThings-CPSCom.2013.250
  • Filename
    6682262