DocumentCode
654717
Title
Integrated 60V vertical DMOS on 0.18um platform for Power over Ethernet IC
Author
Berkovitch, N. ; Herman, Talia ; Jebory, H. ; Levin, S. ; Shapira, Shye
Author_Institution
TowerJazz Semicond., Migdal Haemek, Israel
fYear
2013
fDate
21-23 Oct. 2013
Firstpage
1
Lastpage
4
Abstract
Power Management Integrated Circuits is one of the fastest growing markets in the semiconductor industry, with increasing demand for efficient electronic devices and dense integration schemes. Power over Ethernet designs are some of the most challenging, incorporating multiple channels of large High Voltage FET drivers, along with dense logic cores and high precision analog. The extreme amount of silicon area consumed by the HV drivers and the need for efficient low resistance switching has driven the need to go to area efficient vertical topologies. While vertical structures are widely implemented in discrete device manufacturing, their integration in Power Management Integrated Circuits introduces many challenges. We present a 60V platform based on a 0.18um CMOS technology, integrated with a best in class 60V vertical DMOS, providing a high performance and cost effective platform for PoE designs.
Keywords
CMOS logic circuits; driver circuits; elemental semiconductors; local area networks; logic design; power integrated circuits; silicon; CMOS technology; HV driver; Si; dense integration scheme; dense logic core; discrete device manufacturing; efficient electronic device; high precision analog; high voltage FET driver; low resistance switching; power management integrated circuits; power over Ethernet IC; power over Ethernet design; semiconductor industry; silicon area; size 0.18 mum; vertical DMOS; voltage 60 V; Field effect transistors; Integrated circuits; Logic gates; Performance evaluation; Resistance; Silicon; Standards; 0.18um; DMOS; Ethernet; IC; Integrated; LDMOS; PoE; Power; Rdson; Vertical; over;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwaves, Communications, Antennas and Electronics Systems (COMCAS), 2013 IEEE International Conference on
Conference_Location
Tel Aviv
Type
conf
DOI
10.1109/COMCAS.2013.6685304
Filename
6685304
Link To Document