Title :
Electrical Modeling of On-Chip Cu-Graphene Heterogeneous Interconnects
Author :
Wen-Sheng Zhao ; Da-Wei Wang ; Gaofeng Wang ; Wen-Yan Yin
Author_Institution :
Microelectron. CAD Center, Hangzhou Dianzi Univ., Hangzhou, China
Abstract :
In this letter, novel Cu-graphene heterogeneous interconnects are studied by virtue of the equivalent circuit model. The effective resistances of such interconnects are extracted numerically, with the Cu/graphene and graphene/ graphene interface resistances treated appropriately. It is shown that such interconnects can provide superior performance and reliability over Cu wires for an on-chip interconnect applications.
Keywords :
copper; equivalent circuits; graphene; integrated circuit interconnections; integrated circuit modelling; Cu-C; copper wires; effective resistances; electrical modeling; equivalent circuit model; graphene-graphene interface resistances; on-chip copper-graphene heterogeneous interconnects; reliability; Conductivity; Graphene; Integrated circuit interconnections; Integrated circuit modeling; Nonhomogeneous media; Reliability; Wires; Cu-graphene heterogeneous interconnect; equivalent circuit model; graphene liner;
Journal_Title :
Electron Device Letters, IEEE
DOI :
10.1109/LED.2014.2375358