Low-cost fabrication, eco-friendly materials, and easy integration: The new technological paradigm for the future wireless sensor networks

This paper describes the technological needs of emerging wireless systems for the future generation of wireless sensor networks and the Internet of Things. The success of these wireless networks largely depends on the availability of a low-cost fabrication process, the possibility to employ eco-friendly materials, and the accessibility of easy integration technologies. The use of substrate integrated waveguide (SIW) technology, in conjunction with eco-friendly or recyclable materials (like paper, plastic, and textile), represents a serious candidate to become the new technological paradigm for the future wireless sensor networks. This paper provides a review of the start-of-the-art of SIW components and systems, with particular regards to the use of compact and multi-functional SIW subsystems, the design of compact SIW interconnects and components, and the implementation of SIW structures on paper, plastic, and textile.