• DocumentCode
    655885
  • Title

    Effective utilization of coaxial connector for millimeter wave multilayer device testing

  • Author

    Mozharovskiy, Andrey ; Ssorin, V. ; Artemenko, A. ; Maslennikov, Roman ; Sevastyanov, A.

  • Author_Institution
    Radio Gigabit LLC, Nizhny Novgorod, Russia
  • fYear
    2013
  • fDate
    6-10 Oct. 2013
  • Firstpage
    1271
  • Lastpage
    1274
  • Abstract
    The paper presents an effective technique for utilization of a coaxial connector for millimeter wave measurements of multilayer planar microstrip devices, such as antennas, any passive circuits, or RF chip components integrated on a board. The technique is based on partial end face metallization of a board, which provides effective electrical connection of the microstrip ground plane located on an internal metal layer and an outer conductor of the coaxial connector. It is experimentally demonstrated that utilization of the proposed technique provides a significant improvement of millimeter wave measurements accuracy by lowering the insertion loss. Additionally the technique has no band limitations and can be used from low frequencies up to 100 GHz and above. The proposed technique can be considered as an alternative to waveguide-to-microstrip transitions commonly used for millimeter wave testing or down conversion of the signal frequency before the measurements.
  • Keywords
    electric connectors; metallisation; microstrip components; microstrip transitions; millimetre wave antennas; passive networks; waveguide transitions; RF chip components; antennas; coaxial connector; electrical connection; internal metal layer; microstrip ground plane; millimeter wave measurements; millimeter wave multilayer device testing; multilayer planar microstrip devices; partial end face metallization; passive circuits; signal frequency; waveguide-to-microstrip transitions; Conductors; Connectors; Face; Metallization; Microstrip; Millimeter wave measurements; Millimeter wave technology; millimeter wave measurements; multilayer PCB circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference (EuMC), 2013 European
  • Conference_Location
    Nuremberg
  • Type

    conf

  • Filename
    6686896