• DocumentCode
    655956
  • Title

    A 60-GHz high-gain, low-power, 3.7-dB noise-figure low-noise amplifier in 90-nm CMOS

  • Author

    Hsin-Chih Kuo ; Huey-Ru Chuang

  • Author_Institution
    Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
  • fYear
    2013
  • fDate
    6-10 Oct. 2013
  • Firstpage
    1555
  • Lastpage
    1558
  • Abstract
    This paper presents a 60-GHz high-gain, low-power, 3.7-dB noise-figure (NF), CMOS low-noise amplifier (LNA) fabricated with a 90-nm process. The CMOS LNA exhibited a two-stage cascode structure with a common-source buffer amplifier. To achieve a lower NF and to prevent poor linearity, an inter-stage noise matching inductor and a derivative superposition method were applied to the LNA design. A thin-film microstrip (TFMS) line was used for matching networks and all interconnections. The TFMS line consists of a top metal layer (M9) serving as the signal microstrip line and a bottom metal layer (M1) serving as the ground plane. The measurement results showed that the proposed LNA exhibited the best gain performance of 22 dB at 57.3 GHz and a minimum NF of 3.7 dB at 61 GHz. The input third-order intercept point was -13 dBm. Further, the proposed LNA dissipated a total power of 13.5 mW from a 1.5 V power supply.
  • Keywords
    CMOS integrated circuits; buffer circuits; low noise amplifiers; low-power electronics; microstrip lines; CMOS low noise amplifier; bottom metal layer; common source buffer amplifier; derivative superposition method; frequency 57.3 GHz; frequency 60 GHz; frequency 61 GHz; gain 22 dB; ground plane; high gain amplifier; interstage noise matching inductor; low power amplifier; matching networks; noise figure 3.7 dB; power 13.5 mW; signal microstrip line; size 90 nm; thin film microstrip line; top metal layer; two stage cascode structure; voltage 1.5 V; CMOS integrated circuits; Frequency measurement; Gain; Inductors; Linearity; Noise; Noise measurement; 60-GHz; derivative superposition; low-noise amplifier (LNA); noise matching; thin-film microstrip (TFMS) line;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference (EuMC), 2013 European
  • Conference_Location
    Nuremberg
  • Type

    conf

  • Filename
    6686967