• DocumentCode
    656105
  • Title

    Effects of high neutron fluence on the electrical characteristics of InAs quantum dot structures

  • Author

    Fauzi, Dhiyauddin Ahmad ; Alang, Nahrul Khair ; Rashid, Md. Mamunur ; Omar, Nuurul Iffah Che ; Hasbullah, N.F. ; Zin, Muhammad Rawi Mohamed

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Int. Islamic Univ. Malaysia, Kuala Lumpur, Malaysia
  • fYear
    2013
  • fDate
    28-30 Oct. 2013
  • Firstpage
    227
  • Lastpage
    229
  • Abstract
    The use of InAs quantum dots (QDs) in a well (DWELL) structure as a medium to minimize propagation of neutron induced defects is presented. The DWELL samples and GaAs based commercial diodes were radiated with thermal neutron under maximum fluence of 1.4×l016 neutron/cm2. Based on the current-voltage (I-V) characteristics, it was discovered that the forward bias (FB) leakage current for both devices decreased as an effect of increment in series resistance. In reverse bias (RB), there is significant decrement in leakage current of DWELL samples in the order of 2 orders of magnitude. The RB leakage current of GaAs diode showed similar response as in FB. However, the QD based structures showed less defects compared to the GaAs based diodes.
  • Keywords
    III-V semiconductors; gallium arsenide; indium compounds; leakage currents; neutron effects; quantum dot lasers; semiconductor diodes; semiconductor quantum dots; thermoelectricity; DWELL; GaAs; InAs; commercial diodes; current-voltage characteristics; electrical characteristics; forward bias leakage current; high neutron fluence effects; neutron-induced defects; quantum dot structures; reverse bias; series resistance; thermal neutron irradiation; Gallium arsenide; Indium gallium arsenide; DWELL structure; GaAs infrared emitting diodes; InAs quantum dots; Thermal neutron; displacement damage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photonics (ICP), 2013 IEEE 4th International Conference on
  • Conference_Location
    Melaka
  • Print_ISBN
    978-1-4673-6073-9
  • Type

    conf

  • DOI
    10.1109/ICP.2013.6687122
  • Filename
    6687122