DocumentCode :
656118
Title :
Aluminum doped silica preform fabrication using MCVD and solution doping technique: Effects of various aluminum solution concentrations
Author :
Aljamimi, S.M. ; Yusoff, Z. ; Abdul-Rashid, H.A. ; Khairul Anuar, M.S. ; Muhd-Yasin, S.Z. ; Zulkifli, M.I. ; Hanif, S. ; Tamchek, N.
Author_Institution :
Fac. of Eng., Multimedia Univ., Cyberjaya, Malaysia
fYear :
2013
fDate :
28-30 Oct. 2013
Firstpage :
268
Lastpage :
271
Abstract :
This work is described for solution doping in Modified Chemical Vapor Deposition (MCVD) used for silica optical fiber fabrication. This paper will concentrate on aluminum solution doping and the effect of different solution concentrations. The effect of three different concentrations of aluminum (0.3M,0.7M and 1.2M) with the soot undergo heat treatment are studied while the other parameters of MCVD and solution doping are fixed such as deposition temperature, SiCl4 flow, and soaking time. The refractive index profile(RIP) of each doped preform is measured using preform analyzer to investigate aluminum distribution in the core region. Further investigation about Al distribution across the core sintered layer is also examined by EDX techniques.
Keywords :
X-ray chemical analysis; aluminium; chemical vapour deposition; doping; heat treatment; optical fibres; preforms; refractive index; silicon compounds; soot; EDX techniques; SiO2:Al; aluminum distribution; aluminum doped silica preform fabrication; aluminum solution concentration effects; aluminum solution doping; core region; core sintered layer; deposition temperature; heat treatment; modified chemical vapor deposition parameter; preform analyzer; refractive index profile; silica optical fiber fabrication; soaking time; solution doping parameter; solution doping technique; soot; Aluminum; Optical device fabrication; Optical fiber sensors; Optical fibers; Optical refraction; EPMA (SEM-EDX); MCVD; refractive index profile; solution doping technique;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Photonics (ICP), 2013 IEEE 4th International Conference on
Conference_Location :
Melaka
Print_ISBN :
978-1-4673-6073-9
Type :
conf
DOI :
10.1109/ICP.2013.6687135
Filename :
6687135
Link To Document :
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