• DocumentCode
    656601
  • Title

    Investigation of gate and drain leakage currents of AlGaN/GaN HEMTs at subthreshold regime for temperature range 300K – 400K

  • Author

    Rzin, M. ; Curutchet, A. ; Labat, N. ; Malbert, N. ; Brunel, Loic ; Lambert, B.

  • Author_Institution
    IMS Lab., Talence, France
  • fYear
    2013
  • fDate
    6-8 Oct. 2013
  • Firstpage
    236
  • Lastpage
    239
  • Abstract
    This paper studies the gate and drain leakage currents of AlGaN/GaN high electron mobility transistors on SiC at subthreshold regime for the temperature range 300K - 400K. Positive and negative temperature dependences of the reverse gate current were identified depending on the gate-source bias. The second one might be related to traps located in AlGaN layer or to a virtual gate in the gate drain access region. This was investigated by DC and drain current transient measurements to identify trap effects and their signature.
  • Keywords
    III-V semiconductors; aluminium compounds; electron mobility; electron traps; gallium compounds; high electron mobility transistors; leakage currents; silicon compounds; wide band gap semiconductors; AlGaN-GaN; DC; HEMT; SiC; drain current transient measurements; drain leakage currents; electron mobility transistors; gate drain access region; gate leakage currents; gate-source bias; negative temperature dependences; positive temperature dependences; reverse gate current; subthreshold regime; temperature 300 K to 400 K; trap effects; virtual gate; Aluminum gallium nitride; Gallium nitride; HEMTs; Leakage currents; Logic gates; MODFETs; GaN; High Electron Mobility Transistor (HEMT); leakage current; transient; trap;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Integrated Circuits Conference (EuMIC), 2013 European
  • Conference_Location
    Nuremberg
  • Type

    conf

  • Filename
    6687829