Integrated MEMS by adhesive bonding

Author

Esashi, Masayoshi ; Tanaka, Shoji

Author_Institution

World Premier Int. Res. Center Adv., Tohoku Univ., Sendai, Japan

fYear

2013

fDate

3-6 Nov. 2013

Firstpage

1

Lastpage

4

Abstract

Wafer level adhesive bonding has been applied for the fabrication of micro systems which have heterogeneous components on LSI. MEMS devices of films formed on a carrier wafer are transferred on a LSI wafer, which makes versatile heterogeneous integration possible. Film transfer processes and device transfer processes have been developed and applied to resonator, piezoelectric switch, tactile sensor, electron source. Selective bonding to transfer devices on one carrier wafer to multiple LSI wafers has been developed.

Keywords

adhesive bonding; electron sources; large scale integration; microswitches; piezoelectric devices; resonators; tactile sensors; wafer level packaging; MEMS devices; carrier wafer; device transfer process; electron source; film transfer process; heterogeneous components; heterogeneous integration; integrated MEMS; microsystems; multiple LSI wafers; piezoelectric switch; resonator; selective bonding; tactile sensor; wafer level adhesive bonding; Bonding; Films; Large scale integration; Micromechanical devices; Microswitches; Tactile sensors;

fLanguage

English

Publisher

ieee

Conference_Titel

SENSORS, 2013 IEEE

Conference_Location

Baltimore, MD

ISSN

1930-0395

Type

conf

DOI

10.1109/ICSENS.2013.6688122

Filename

6688122