Development of a tri-axis vortex convective gyroscope with suspended silicon thermistors

Author

Honglong Chang ; Pingwei Zhou ; Xianghui Gong ; Jianbing Xie ; Weizheng Yuan

Author_Institution

MOE Key Lab. of Micro/Nano Syst. for Aerosp., Northwestern Polytech. Univ., Xi´an, China

fYear

2013

fDate

3-6 Nov. 2013

Firstpage

1

Lastpage

4

Abstract

This paper reports a tri-axis vortex convective gyroscope, in which a type of suspended silicon thermistor in arch shape is proposed to reduce the thermal-induced stress, heat dissipation to the substrate. The arch structure of the thermistor reduced the thermal-induced stress up to 86% as compared with the clamped-clamped thermistor in our previous work. The experimental test results showed that sensitivities of the sensor for X-axis, Y-axis and Z-axis gyroscope were 0.642mV/°/s, 0.528mV/°/s and 0.241mV/°/s, respectively. The sensitivity improvement reached 49.65%, 56.21% and 51.57% for each axis. The measured nonlinearity for X-axis, Y-axis and Z-axis gyroscope were 2.1%, 3.8% and 4.5% in the range of ±100 °/s, respectively. An improvement of 23.53%, 36.67% and 6.25% on the linearity was obtained.

Keywords

cooling; elemental semiconductors; gyroscopes; silicon; thermal stresses; thermistors; Si; X-axis gyroscope; Y-axis gyroscope; Z-axis gyroscope; arch structure; clamped-clamped thermistor; heat dissipation; measured nonlinearity; sensitivity improvement; suspended silicon thermistors; thermal-induced stress reduction; triaxis vortex convective gyroscope; Gyroscopes; Heating; Silicon; Stress; Substrates; Thermal stresses; Thermistors;

fLanguage

English

Publisher

ieee

Conference_Titel

SENSORS, 2013 IEEE

Conference_Location

Baltimore, MD

ISSN

1930-0395

Type

conf

DOI

10.1109/ICSENS.2013.6688239

Filename

6688239