• DocumentCode
    656977
  • Title

    Torwards a fully-integrated CMOS microcalorimeter with on-chip quasi-digital output signal

  • Author

    Munoz-Contreras, F. ; Verd, Jaume ; Segura, Jaume ; Uranga, A. ; Riverola, M. ; Barniol, N.

  • Author_Institution
    Electron. Syst. Group (GSE-UIB), Univ. de les Illes Balears, Palma, Spain
  • fYear
    2013
  • fDate
    3-6 Nov. 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    We analyze and characterize the static and dynamic thermal response of two sub-micrometer scale metal beam resonators to evaluate its potential as resonant thermal sensors. The fabricated resonators are a cantilever and a CC-beam which resonant frequency, around 6.5 MHz and 15 MHz respectively, changes due to the heat received from a probe pad, acting as a sample stage, through a metal track. Unlike other works, where off-chip piezoelectric excitation and optical readout are used, the mechanical resonator constitutes the frequency-determining element of an oscillator circuit that is fully-integrated in a 0.35-μm CMOS chip. For this first prototypes a heat conduction efficiency of 5.5% has been obtained for the metal CC-beam and a temperature resolution at the sample stage as low as 3.5 mK. In addition, some sensor layout considerations are detailed to further increase the sensor performance in future designs.
  • Keywords
    CMOS integrated circuits; cantilevers; micromechanical resonators; microsensors; oscillators; piezoelectric transducers; signal processing equipment; temperature sensors; CC-beam; frequency determining element; fully integrated CMOS microcalorimeter; mechanical resonator; off-chip piezoelectric excitation; on-chip quasidigital output signal; optical readout; oscillator circuit; resonant thermal sensor; size 0.35 mum; submicrometer scale metal beam resonator; Frequency measurement; Heating; Metals; Optical resonators; Oscillators; Resonant frequency; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SENSORS, 2013 IEEE
  • Conference_Location
    Baltimore, MD
  • ISSN
    1930-0395
  • Type

    conf

  • DOI
    10.1109/ICSENS.2013.6688253
  • Filename
    6688253