• DocumentCode
    656986
  • Title

    A readout circuit for wireless passive resonant-circuit sensors

  • Author

    Kaikai Bao ; Deyong Chen ; Qiang Shi ; Jian Chen ; Junbo Wang

  • Author_Institution
    State Key Lab. of Transducer Technol., Inst. of Electron., Beijing, China
  • fYear
    2013
  • fDate
    3-6 Nov. 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper presents a readout circuit for wireless passive LC sensors, where the phase of the readout coil shows a small "dip" nearby the sensor\´s resonant frequency in the low-coupling-coefficient condition (a distance between the readout coil and the LC tank longer than 100 mm). To address this issue and enhance device sensitivity, in this study, a new symmetrical differential drive circuit was proposed where theoretical analysis and experimental verification were performed. The symmetrical differential drive circuit amplified the phase-dip at least 6 times when the scale factor between the reference inductor and the readout coil was 1.138. The proposed readout circuit was used to detect the variations of pressure with a 12 mm×12 mm×14 mm LC pressure sensor at an operational distance up to 100 mm between the LC sensor and the readout circuit, recording a measurement resolution lower than 0.4 kPa.
  • Keywords
    LC circuits; amplification; circuit resonance; coils; driver circuits; inductors; passive networks; pressure sensors; readout electronics; wireless sensor networks; LC pressure sensor; coupling coefficient; device sensitivity enhancement; inductor; measurement resolution; phase dip amplification; pressure variation detection; readout circuit; readout coil; resonant frequency; scale factor; size 12 mm; size 14 mm; symmetrical differential drive circuit; wireless passive LC sensor; wireless passive resonant circuit sensor; Coils; Impedance; Impedance measurement; Temperature sensors; Wireless communication; Wireless sensor networks;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SENSORS, 2013 IEEE
  • Conference_Location
    Baltimore, MD
  • ISSN
    1930-0395
  • Type

    conf

  • DOI
    10.1109/ICSENS.2013.6688262
  • Filename
    6688262