DocumentCode
657108
Title
A micro-pressure sensor with high sensitivity and overload resistance
Author
Zhongliang Yu ; Yulong Zhao ; Cun Li ; Yan Liu ; Guanwu Zhou ; Bian Tian
Author_Institution
State Key Lab. for Manuf. Syst. Eng., Xi´an Jiaotong Univ., Xi´an, China
fYear
2013
fDate
3-6 Nov. 2013
Firstpage
1
Lastpage
4
Abstract
Presented is a piezoresistive absolute micro-pressure sensor, which features relatively high sensitivity and overload resistance simultaneously. In this investigation, the design, fabrication and testing of the sensor are carried out. By analyzing the stress distribution on sensitive elements using the finite-element method (FEM), an improved structure through introduction of sensitive beams and islands is built up. The proposed configuration presents its advantages in terms of sensitivity and overload resistance compared with the bossed diaphragm and plane diaphragm structures. The sensor is fabricated based on silicon bulk micromachining technology, and the processing is discussed. Testing results demonstrate the sensor features a relatively high sensitivity of 16.544 μV/V/Pa in the operating range of 500 Pa at room temperature, and a proper overload resistance of 200 times overpressure. Due to the favorable characteristics, the sensor can be utilized in measuring absolute micro pressure.
Keywords
diaphragms; elemental semiconductors; finite element analysis; micromachining; microsensors; piezoresistive devices; pressure sensors; silicon; stress analysis; FEM; Si; absolute micropressure measurement; bossed diaphragm structure; finite-element method; overload resistance; piezoresistive absolute micropressure sensor; plane diaphragm structure; sensitivity resistance; silicon bulk micromachining technology; stress distribution analysis; temperature 293 K to 298 K; Piezoresistance; Pressure measurement; Sensitivity; Silicon; Stress; Temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
SENSORS, 2013 IEEE
Conference_Location
Baltimore, MD
ISSN
1930-0395
Type
conf
DOI
10.1109/ICSENS.2013.6688392
Filename
6688392
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