• DocumentCode
    657108
  • Title

    A micro-pressure sensor with high sensitivity and overload resistance

  • Author

    Zhongliang Yu ; Yulong Zhao ; Cun Li ; Yan Liu ; Guanwu Zhou ; Bian Tian

  • Author_Institution
    State Key Lab. for Manuf. Syst. Eng., Xi´an Jiaotong Univ., Xi´an, China
  • fYear
    2013
  • fDate
    3-6 Nov. 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Presented is a piezoresistive absolute micro-pressure sensor, which features relatively high sensitivity and overload resistance simultaneously. In this investigation, the design, fabrication and testing of the sensor are carried out. By analyzing the stress distribution on sensitive elements using the finite-element method (FEM), an improved structure through introduction of sensitive beams and islands is built up. The proposed configuration presents its advantages in terms of sensitivity and overload resistance compared with the bossed diaphragm and plane diaphragm structures. The sensor is fabricated based on silicon bulk micromachining technology, and the processing is discussed. Testing results demonstrate the sensor features a relatively high sensitivity of 16.544 μV/V/Pa in the operating range of 500 Pa at room temperature, and a proper overload resistance of 200 times overpressure. Due to the favorable characteristics, the sensor can be utilized in measuring absolute micro pressure.
  • Keywords
    diaphragms; elemental semiconductors; finite element analysis; micromachining; microsensors; piezoresistive devices; pressure sensors; silicon; stress analysis; FEM; Si; absolute micropressure measurement; bossed diaphragm structure; finite-element method; overload resistance; piezoresistive absolute micropressure sensor; plane diaphragm structure; sensitivity resistance; silicon bulk micromachining technology; stress distribution analysis; temperature 293 K to 298 K; Piezoresistance; Pressure measurement; Sensitivity; Silicon; Stress; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SENSORS, 2013 IEEE
  • Conference_Location
    Baltimore, MD
  • ISSN
    1930-0395
  • Type

    conf

  • DOI
    10.1109/ICSENS.2013.6688392
  • Filename
    6688392