• DocumentCode
    657212
  • Title

    CMOS sensor for sun tracking

  • Author

    Hongyi Wang ; Tao Luo ; Hongjiang Song ; Christen, Jennifer Blain

  • Author_Institution
    Dept. of Microelectron., Xi´an Jiaotong Univ., Xi´an, China
  • fYear
    2013
  • fDate
    3-6 Nov. 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    We present an optical localization chip capable of detecting the direction of incident light. The chip requires no offchip optical or mechanical components or post-processing (e.g. baffles, slits, mirrors, etc.). The chip was fabricated in a standard 0.5 μm CMOS (complementary metal oxide semiconductor) process. Our approach employs 100 light sensing cells, each having two detectors separated by a metal “wall”. The “wall” was created by stacking all metal layers, contacts and vias available in the process. This metal stack “wall” is used to create on-chip shadowing to facilitate detection. Each optical detection element produces a differential output with the normalized difference between the currents dependent upon the angle of the incident light. The width of the photodiodes is limited by the height of the metal wall to only a few micrometers. To achieve a good sensitivity, 100 cells are placed in parallel. Test results show good sensitivity to the direction and intensity of the incident light with accuracy of 1.9 degrees over a 100 degree range and 1.1 degrees over a 50 degree range.
  • Keywords
    CMOS image sensors; optical sensors; photodetectors; photodiodes; CMOS sensor; angle of incident light; complementary metal oxide semiconductor; contact; direction of incident light detection; light sensing cell; metal layer stacking; metal stack wall; on-chip shadowing; optical detection element; optical localization chip; photodiode; size 0.5 mum; sun tracking; Metals; Optical device fabrication; Optical sensors; Optical variables measurement; Photodiodes; Semiconductor device measurement; Sun;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SENSORS, 2013 IEEE
  • Conference_Location
    Baltimore, MD
  • ISSN
    1930-0395
  • Type

    conf

  • DOI
    10.1109/ICSENS.2013.6688498
  • Filename
    6688498