DocumentCode :
658874
Title :
A stacked full-bridge topology for high voltage DC-AC conversion in standard CMOS technology
Author :
Callemeyn, Piet ; Steyaert, M.
Author_Institution :
ESAT-MICAS, KU Leuven, Leuven, Belgium
fYear :
2013
fDate :
11-13 Nov. 2013
Firstpage :
65
Lastpage :
68
Abstract :
A monolithic DC-AC converter is realized in a 130 nm 1.2V CMOS technology using a Class-D half-bridge topology. Several dies are combined to achieve a full-bridge topology, realizing a bipolar output voltage. Using a stacking technique, this output voltage can be increased. This yields AC output voltages up to 4V, which is more than three times the nominal 1.2V supply voltage of the technology. The passives are integrated on-chip. Consequently, the bill of materials (BOM) is heavily reduced. In a standard half-bridge topology, bulky external capacitors are needed to filter out the DC offset. This main obstacle of an off-chip capacitor is alleviated in the full-bridge topology, reducing the BOM even more. An output peak-to-peak voltage of 3.8V is achieved at a maximal efficiency of 58.3%. A total output power of 56mW is obtained.
Keywords :
CMOS integrated circuits; DC-AC power convertors; bridge circuits; class-D half bridge topology; efficiency 58.3 percent; high voltage DC-AC conversion; monolithic DC-AC converter; off chip capacitor; power 56 mW; size 130 nm; stacked full bridge topology; standard CMOS technology; voltage 1.2 V; voltage 3.8 V; voltage 4 V; Bills of materials; CMOS integrated circuits; CMOS technology; Capacitors; Inverters; System-on-chip; Topology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Circuits Conference (A-SSCC), 2013 IEEE Asian
Conference_Location :
Singapore
Print_ISBN :
978-1-4799-0277-4
Type :
conf
DOI :
10.1109/ASSCC.2013.6690983
Filename :
6690983
Link To Document :
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