• DocumentCode
    658956
  • Title

    A 1.2 V 285μA analog front end chip for a digital hearing aid in 0.13 μm CMOS

  • Author

    Sukumaran, Amrith ; Karanjkar, Kunal ; Jhanwar, Sandeep ; Krishnapura, Nagendra ; Pavan, Shanthi

  • Author_Institution
    Dept. of Electr. Eng., Indian Inst. of Technol. Madras, Chennai, India
  • fYear
    2013
  • fDate
    11-13 Nov. 2013
  • Firstpage
    397
  • Lastpage
    400
  • Abstract
    We describe a low power analog front-end for a digital hearing aid, designed and fabricated in a 0.13μm CMOS process. The IC accepts inputs from a microphone or telecoil, amplifies and digitizes it for processing by a DSP, accepts digital data from the DSP, converts it to analog form using a pulse width modulated class D amplifier, and drives the earpiece, all over a 10kHz bandwidth. The programmable gain amplifier uses current sharing in the input stage to obtain low noise with low power consumption. The single-bit continuous-time ΔΣ ADC and the closed loop class-D amplifier use assisted opamp integrators to reduce power dissipation. An on chip ring oscillator provides the clock to the digital parts of the chip and to the digital signal processor (DSP). The chip has an input referred noise of 2.1μV, a dynamic range of 106 dB, an output THD of 0.006% and a peak output SNR of 79dB. It occupies 2.3 mm2 and consumes 285μA from a 1.2V supply.
  • Keywords
    CMOS integrated circuits; analogue-digital conversion; delta-sigma modulation; digital signal processing chips; hearing aids; integrating circuits; operational amplifiers; CMOS process; DSP; analog front end chip; closed loop class D amplifier; continuous time delta sigma ADC; current 285 muA; digital hearing aid; digital signal processor; microphone; opamp integrators; programmable gain amplifier; ring oscillator; size 0.13 mum; telecoil; voltage 1.2 V; Auditory system; Digital signal processing; Electronics packaging; Gain; Noise; Pulse width modulation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference (A-SSCC), 2013 IEEE Asian
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4799-0277-4
  • Type

    conf

  • DOI
    10.1109/ASSCC.2013.6691066
  • Filename
    6691066