• DocumentCode
    658978
  • Title

    Optimally minimizing overlay violation in self-aligned double patterning decomposition for row-based standard cell layout in polynomial time

  • Author

    Zigang Xiao ; Yuelin Du ; Haitong Tian ; Wong, Martin D. F.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
  • fYear
    2013
  • fDate
    18-21 Nov. 2013
  • Firstpage
    32
  • Lastpage
    39
  • Abstract
    Self-aligned double patterning is one of the most promising double patterning techniques for sub-20nm nodes. As in any multiple patterning techniques, layout decomposition is the most important problem. In SADP decomposition, overlay is among the most primary concerns. Most of the existing works target at minimizing the overall overlay, while others totally forbid the overlay. On the other hand, most of the works either rely on exponential time methods, or apply heuristic that cannot guarantee to find a solution. In this paper, we consider the SADP decomposition problem in row-based standard cell layout, where the overlay violations are minimized. Although SADP decomposition has been shown to be NP-hard in general, we showed that it can be solved in polynomial time when the layout is row-based standard cells. We propose a polynomial time optimal algorithm that finds a decomposition with minimum overlay violations. The efficiency of our method is further demonstrated by the experimental results.
  • Keywords
    circuit layout; computational complexity; immersion lithography; nanopatterning; polynomials; NP-hard problem; SADP decomposition problem; exponential time methods; layout decomposition; overlay violations; polynomial time optimal algorithm; row-based standard cell layout; self-aligned double patterning decomposition problem; Algorithm design and analysis; Computer aided manufacturing; Layout; Merging; Polynomials; Shape; Standards;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer-Aided Design (ICCAD), 2013 IEEE/ACM International Conference on
  • Conference_Location
    San Jose, CA
  • ISSN
    1092-3152
  • Type

    conf

  • DOI
    10.1109/ICCAD.2013.6691094
  • Filename
    6691094