• DocumentCode
    659012
  • Title

    ICCAD-2013 CAD contest in placement finishing and benchmark suite

  • Author

    Myung-Chul Kim ; Viswanathan, Natarajan ; Zhuo Li ; Alpert, Charles

  • Author_Institution
    IBM Corportation, Austin, TX, USA
  • fYear
    2013
  • fDate
    18-21 Nov. 2013
  • Firstpage
    268
  • Lastpage
    270
  • Abstract
    At advanced technology nodes, highly-optimized placements need careful post-processing to further reduce interconnect length or optimize resource distribution, and therefore, high-performance legalization and detailed placement steps are essential for performance. In the last decade, we observed impressive improvements both in quality and speed of academic placement algorithms, in part enabled by the availability of realistic benchmarks and common evaluation frameworks along the history of ISPD, DAC and ICCAD placement contests. However, most research innovations have heavily relied on improvement and extensions of global placement algorithms [4, 5, 8, 9, 12, 15]. Detailed placement has been often limited to mixing existing methods and local interconnect length recovery, and individual impacts and relative performances of different detailed placement algorithms remain unclear. The goal of the ICCAD-2013 detailed-placement contest is to address these issues. In this contest, we provide (i) a suite of realistic benchmarks derived from industrial ASIC including input legal placements to detailed placers, and (ii) an evaluation framework to specifically measure the impact of detailed placement optimizations. To judge the quality of resulting placements, we consider both Half-Perimeter Wirelength (HPWL) and placement density, and impose maximum cell displacement limitations to the detailed placers. We hope that a set of standardized benchmarks and an evaluation framework will further accelerate research in the area of detailed placement.
  • Keywords
    VLSI; integrated circuit design; logic CAD; DAC placement contests; HPWL; ICCAD placement contests; ICCAD-2013 detailed-placement contest; ISPD placement contests; application specific integrated circuits; benchmark suite; global placement algorithms; half-perimeter wirelength; high-performance legalization; highly-optimized placements; industrial ASIC; interconnect length; placement density; placement finishing; research innovations; resource distribution; Algorithm design and analysis; Benchmark testing; Law; Measurement; Optimization; Runtime; Algorithms; Optimization; Physical Design; Placement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer-Aided Design (ICCAD), 2013 IEEE/ACM International Conference on
  • Conference_Location
    San Jose, CA
  • ISSN
    1092-3152
  • Type

    conf

  • DOI
    10.1109/ICCAD.2013.6691130
  • Filename
    6691130