Flex to flex bonding using anisotropic conductive film for imaging systems

Author

Imenes, Kristin ; Nguyen, H.-V. ; Lifjeld, A. ; Eggen, Trym ; Baumgartner, C.E. ; Aasmundtveit, Knut E.

Author_Institution

Dept. of Micro & Nano Syst. Technol., HiVe-Vestfold Univ. Coll., Borre, Norway

fYear

2013

fDate

9-12 Sept. 2013

Firstpage

1

Lastpage

4

Abstract

Bonding and integration technologies in ultrasound probes are challenging due to space limitations. Flexible substrates, with the benefits of being bendable, small and allows 3D integration, is an excellent choice for signal transferring in such systems. We have chosen to use anisotropic conductive film (ACF) as interconnection technology and the quality and the reliability of a flex-ACF-flex bonding have been studied. The relationship between bonding force and contact resistance have been characterized including the effect of thermal cycling tests and humidity tests. The study shows that flex-ACF-flex is a robust bonding technique which has very good performance also after environmental tests and is well suited for interconnection in ultrasonic transducer probes.

Keywords

anisotropic media; bonding processes; flexible electronics; integrated circuit interconnections; substrates; thin films; ultrasonic imaging; ultrasonic transducers; 3D integration; anisotropic conductive film; bonding force; contact resistance; flex-ACF-flex bonding; flexible substrates; humidity tests; interconnection technology; signal transferring; thermal cycling tests; ultrasonic transducer probes; Bonding; Contact resistance; Flexible printed circuits; Humidity; Probes; Reliability; Ultrasonic imaging; ACF; bonding; flexible substrate; imaging; packaging;

fLanguage

English

Publisher

ieee

Conference_Titel

Microelectronics Packaging Conference (EMPC) , 2013 European

Conference_Location

Grenoble

Type

conf

Filename

6698614