DocumentCode :
668929
Title :
Robust PoP probing solutions for high-performance application processor developments
Author :
Weiliang Yuan ; Sungjoo Kim ; Woong Hwan Ryu ; Seongjae Moon ; Sangmin Lee
Author_Institution :
Design Technol., Syst. LSI, Samsung Electron., Yongin, South Korea
fYear :
2013
fDate :
27-30 Oct. 2013
Firstpage :
159
Lastpage :
162
Abstract :
Probing solution is crucial for the designs and validation of high-speed PoP devices in high-performance mobile application processor (AP) development, where PoP assembly technology is used to achieve high data throughput & low cost. The paper has developed robust PoP probing solution for AP product development based on microwave network theory, including probe loading effect minimization, probing channel propagation removal, waveform reconstruction at die pad and interposer/socket de-embedding, which are applied to the latest mobile application processor development. It is also straight forward and natural to extend the developed methods to TSV-based devices with WideIO interface.
Keywords :
integrated circuit packaging; product development; three-dimensional integrated circuits; PoP assembly technology; PoP probing solution; TSV based device; WideIO interface; die pad; high performance AP development; high speed PoP device; interposer; microwave network theory; mobile application processor development; probe loading effect minimization; probing channel propagation removal; socket deembedding; waveform reconstruction; Accuracy; Loading; Microwave theory and techniques; Mobile communication; Probes; Resistors; Sockets; application processor (AP); de-embedding; package-on-package (PoP); probing; waveform reconstruction;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2013 IEEE 22nd Conference on
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4799-0705-2
Type :
conf
DOI :
10.1109/EPEPS.2013.6703489
Filename :
6703489
Link To Document :
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