Implementation of a RF front-end module by embedding ICs in molding package

This paper presents a front-end module (FEM) for Wireless Personal Area Network (WPAN). This module is composed of a switch IC for Tx/Rx, a Tx Balun, and Rx bandpass filter (BPF). These components are embedded in molding package by employing the proposed package technology. Molding package process is to add lamination and pattern in contrast to normal package of ICs. This process, therefore, has advantage of short connection from chip to chip, compact size, and low cost in comparison to package using wire-bonding. Embedded components are connected by copper line on molding package. In order to implement a proposed FEM, commercial switch IC, a Balun, and a BPF by using integrated passive device (IPD) technology are embedded. The size of implemented FEM module is given as 3.8 mm × 2.6 mm × 0.6 mm. A FEM is, at first, measured in view of S-parameter and then it is tested in test environment for WPAN system. Tx path and Rx path include a switch and there are a Tx Balun and a Rx BPF in each path. Measured insertion loss and return loss in Rx path are better than 1.7 dB and 15.4 dB, respectively. In Tx path which include Balun, measured insertion loss, return loss, and phase unbalance are almost 1.7 dB, 16.3 dB, and 2 degree, respectively. Measured Tx power and Rx sensitivity in overall WPAN system by applying implemented module are 18.6 dBm and -74 dBm at error rate 0.4 % The WPAN system has good performance by using implemented module.