DocumentCode
6697
Title
Worst Case Sampling Method to Estimate the Impact of Random Variation on Static Random Access Memory
Author
Gyo Sub Lee ; Changhwan Shin
Author_Institution
Sch. of Electr. & Comput. Eng., Univ. of Seoul, Seoul, South Korea
Volume
62
Issue
6
fYear
2015
fDate
Jun-15
Firstpage
1705
Lastpage
1709
Abstract
We propose a worst case sampling method for quantitatively estimating the impact of random variation on static random access memory (SRAM) cells. This method enables us to predict the values of SRAM read/write metrics beyond the Six Sigma regime. First, we developed a compact model with a Monte Carlo simulation. The model includes both device modeling and sample size extension to predict and quickly estimate SRAM read/write metrics accurately. We verified the accuracy of the model by comparing the simulation results to previously published silicon data. Our results provide circuit designers with insight into the impact of random variations on SRAM cells. In particular, we demonstrate how SRAM cell operations can be protected from harsh random variations using word-line voltage margins as the key parameter.
Keywords
Monte Carlo methods; SRAM chips; elemental semiconductors; silicon; Monte Carlo simulation; SRAM read-write metrics; Si; circuit designers; random variation; silicon data; six sigma regime; static random access memory; word-line voltage margins; worst case sampling; CMOS integrated circuits; Data models; Measurement; Optical wavelength conversion; SRAM cells; Sampling methods; CMOS; fin-shaped field-effect transistor (FinFET); random variation; static random access memory (SRAM); static random access memory (SRAM).;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2014.2361913
Filename
6932485
Link To Document