Title :
A novel 3D stacking method for opto-electronic dies on CMOS ICs
Author :
Duan, Pinxiang ; Raz, Oded ; Smalbrugge, B.E. ; Duis, Jeroen ; Dorren, H.J.S.
Author_Institution :
COBRA Res. Sch., Eindhoven Univ. of Technol., Eindhoven, Netherlands
Abstract :
High speed, high density and low cost solution for realizing optical interconnects is presented. An opto-electronic die, directly bonded on top of CMOS IC driver, is connected using metal traces lithographically defined. A twelve channel transmitter based on the technique was fabricated, and test shows good performance up to 12.5 Gb/s/ch.
Keywords :
CMOS integrated circuits; integrated optics; integrated optoelectronics; optical fabrication; optical interconnections; optical transmitters; CMOS IC driver; high speed high density low cost optical interconnects; lithography; metal traces; novel 3D stacking method; optoelectronic dies; twelve channel transmitter; Arrays; Bonding; CMOS integrated circuits; Metals; Resists; Three-dimensional displays; Vertical cavity surface emitting lasers;
Conference_Titel :
Optical Communications (ECOC), 2012 38th European Conference and Exhibition on
Conference_Location :
Amsterdam
