DocumentCode
670918
Title
A novel 3D stacking method for opto-electronic dies on CMOS ICs
Author
Duan, Pinxiang ; Raz, Oded ; Smalbrugge, B.E. ; Duis, Jeroen ; Dorren, H.J.S.
Author_Institution
COBRA Res. Sch., Eindhoven Univ. of Technol., Eindhoven, Netherlands
fYear
2012
fDate
16-20 Sept. 2012
Firstpage
1
Lastpage
3
Abstract
High speed, high density and low cost solution for realizing optical interconnects is presented. An opto-electronic die, directly bonded on top of CMOS IC driver, is connected using metal traces lithographically defined. A twelve channel transmitter based on the technique was fabricated, and test shows good performance up to 12.5 Gb/s/ch.
Keywords
CMOS integrated circuits; integrated optics; integrated optoelectronics; optical fabrication; optical interconnections; optical transmitters; CMOS IC driver; high speed high density low cost optical interconnects; lithography; metal traces; novel 3D stacking method; optoelectronic dies; twelve channel transmitter; Arrays; Bonding; CMOS integrated circuits; Metals; Resists; Three-dimensional displays; Vertical cavity surface emitting lasers;
fLanguage
English
Publisher
ieee
Conference_Titel
Optical Communications (ECOC), 2012 38th European Conference and Exhibition on
Conference_Location
Amsterdam
Type
conf
Filename
6706178
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