• DocumentCode
    671192
  • Title

    Responsivity optimization of a MQW SOI-based lateral PIN photodiode using Taguchi´s L27 orthogonal array

  • Author

    Menon, P. Susthitha ; Tasirin, S. Kalthom ; Ahmad, Ishtiaq ; Abdullah, S. Fazlili ; Apte, Prakash R.

  • Author_Institution
    Inst. of Microeng. & Nanoelectron. (IMEN), Univ. Kebangsaan Malaysia, Bangi, Malaysia
  • fYear
    2013
  • fDate
    25-27 Sept. 2013
  • Firstpage
    254
  • Lastpage
    257
  • Abstract
    Silicon-on-insulator (SOI)-based lateral PIN photodiodes using SiGe/Si multilayer quantum wells (MQW) are suitable for applications in the near-infrared range both for sensing and optical fiber communication application. The objective of this paper is to optimize the process parameters for such a device using Taguchi´s L27 orthogonal array. Five device process parameters and two device noise factors were identified to make the virtual device design insensitive to variation in the selected fabrication parameters. The results obtained for responsivity after the optimization approach was 0.33 A/W for the optimized device with intrinsic region length of 6 μm, photo-absorption layer thickness of 0.505 μm, incident optical power of 0.5 mW/cm2, bias voltage of 3.5 V and SOI layer thickness of 0.5 μm. The percentage of improvement for the device´s responsivity is 27% as compared to the previous work.
  • Keywords
    Ge-Si alloys; Taguchi methods; elemental semiconductors; integrated optoelectronics; optical design techniques; optical fabrication; p-i-n photodiodes; photodetectors; photoexcitation; semiconductor device noise; semiconductor quantum wells; silicon; silicon-on-insulator; MQW SOI-based lateral PIN photodiode; SiGe-Si; Taguchi L27 orthogonal array; bias voltage; device noise factors; device process parameters; fabrication parameters; incident optical power; intrinsic region length; multilayer quantum wells; near-infrared range; optical fiber communication; photoabsorption layer thickness; responsivity optimization; sensing application; silicon-on-insulator; size 0.5 mum; size 0.505 mum; virtual device design; voltage 3.5 V; Arrays; Optimization; PIN photodiodes; Quantum well devices; Silicon; Silicon germanium; L27 orthogonal array; SOI; SiGe/Si; Taguchi method; photodiode; quantum dot;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro and Nanoelectronics (RSM), 2013 IEEE Regional Symposium on
  • Conference_Location
    Langkawi
  • Print_ISBN
    978-1-4799-1181-3
  • Type

    conf

  • DOI
    10.1109/RSM.2013.6706523
  • Filename
    6706523