Title :
Welcome message from Wun-Yan Chen, conference chair
Abstract :
Presents the welcome message from the conference proceedings.
Keywords :
Educational institutions; Electronics packaging; Joints; Market research; Organizing; Packaging; Printed circuits;
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2013 8th International
Conference_Location :
Taipei, Taiwan
DOI :
10.1109/IMPACT.2013.6706617
