Title :
A thermal model for electrothermal simulation of power modules
Author :
Jinlei Meng ; Xuhui Wen ; Yulin Zhong ; Zhijie Qiu ; Liang Kong
Author_Institution :
Univ. of Chinese Acad. of Sci., Beijing, China
Abstract :
A thermal model of power modules based on the physical dimension and thermal properties is proposed in this paper. The heat path in the power module is considered as a one-dimensional heat transfer in the model. The method of the parameters extraction for the model is given in the paper. With high speed and accuracy, the thermal model is suit for electrothermal simulation. The proposed model is verified by experimental results.
Keywords :
circuit simulation; heat transfer; power semiconductor devices; thermal analysis; 1D heat transfer; electrothermal simulation; heat path; parameter extraction; power electronic chips; power modules; thermal model; Finite element analysis; Heat transfer; Junctions; Mathematical model; Multichip modules; Thermal resistance;
Conference_Titel :
Electrical Machines and Systems (ICEMS), 2013 International Conference on
Conference_Location :
Busan
Print_ISBN :
978-1-4799-1446-3
DOI :
10.1109/ICEMS.2013.6713313
