• DocumentCode
    676456
  • Title

    Design and simulation of polymer piezo-electric MEMS microphone

  • Author

    Muralidhar, Y.C. ; Neethu, K.N. ; Nagaraja, Veda Sandeep ; Pinjare, S.L.

  • Author_Institution
    Reva Inst. of Technol. & Manage., Bangalore, India
  • fYear
    2013
  • fDate
    27-28 Dec. 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The development of the MEMS microphone has been an active area of research over the past several decades. MEMS microphones have advantages such as compact size, high signal-to-noise ratio, high sensitivity, quick response, and long term stability. MEMS microphone is also compatible with the surface mount process. There are various design considerations for MEMS microphone such as less interference, better sound quality, higher sensitivity, higher signal to noise ratio, less current drain, and low distortion. MEMS microphones are similar to the standard ECMs (electrets condenser microphones) found in modern consumer electronics, except that the components are built onto a single chip using CMOS technology (material deposition & etching), rather than assembled from discrete parts. In this an SU8 polymer MEMS piezoelectric microphone is designed and simulated using COMSOL Multiphysics tool. The physics used for analysis is structural mechanics and Piezo-Electric Devices.
  • Keywords
    CMOS integrated circuits; consumer electronics; electrets; micromechanical devices; microphones; piezoelectric devices; polymers; surface mount technology; CMOS technology; COMSOL Multiphysics tool; ECMs; SU8 polymer MEMS piezoelectric microphone; consumer electronics; current drain; electrets condenser microphones; etching; long term stability; low distortion; material deposition; piezoelectric devices; signal-to-noise ratio; structural mechanics; surface mount process; Gold; Micromechanical devices; Microphones; Physics; Polymers; Silicon; ECM; MEMS; Microphone;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits, Controls and Communications (CCUBE), 2013 International conference on
  • Conference_Location
    Bengaluru
  • Print_ISBN
    978-1-4799-1599-6
  • Type

    conf

  • DOI
    10.1109/CCUBE.2013.6718562
  • Filename
    6718562