• DocumentCode
    678335
  • Title

    Simulation study for Dual Material Gate Hetero-Dielectric TFET: Static performance analysis for analog applications

  • Author

    Upasana ; Narang, Rakhi ; Gupta, Madhu ; Saxena, Manoj

  • Author_Institution
    Dept. of Electron. Sci., Univ. of Delhi, New Delhi, India
  • fYear
    2013
  • fDate
    13-15 Dec. 2013
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    This paper presents simulation study of Static characteristics for DMG (Dual Material Gate) Hetero-Dielectric (H-D) Tunnel FET. Here, two previously reported device architectures i.e. a DMG Single Dielectric TFET and SMG (Single Material Gate) Hetero-Dielectric TFET have been optimized by tuning the work functions and length and later on their combined impact on the proposed device architecture i.e. DMG Hetero-Dielectric Tunnel FET (DMG H-D TFET) is been studied. Electrical parameters such as threshold voltage, drain current Ids, Sub threshold Slope, Ion to Ioff ratio, ambipolar current Iamb have been studied. Some of the important analog parameters like transconductance gm, drain conductance gd, Output resistance Rout, transconductance generation efficiency gm/Ids have also been studied using ATLAS Device Simulation Software.
  • Keywords
    dielectric devices; field effect transistors; tunnel transistors; work function; ATLAS Device Simulation Software; DMG heterodielectric tunnel FET; ambipolar current; analog applications; analog parameters; drain conductance; dual material gate; electrical parameters; single material gate; static characteristics; static performance analysis; transconductance generation; work functions; Dielectrics; Field effect transistors; High K dielectric materials; Logic gates; Performance evaluation; Threshold voltage; Double Gate; Dual Material Gate; Hetero-Dielectric; Tunnel FET;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    India Conference (INDICON), 2013 Annual IEEE
  • Conference_Location
    Mumbai
  • Print_ISBN
    978-1-4799-2274-1
  • Type

    conf

  • DOI
    10.1109/INDCON.2013.6725867
  • Filename
    6725867