DocumentCode
678776
Title
Performance comparison between air-gap based coaxial TSV and conventional circular TSV in 3D-ICs
Author
Salah, Khaled
fYear
2013
fDate
16-18 Dec. 2013
Firstpage
1
Lastpage
3
Abstract
In this paper, performance comparison between Air-Gap Based Coaxial TSV and conventional circular TSV are presented. The comparison shows that the air-gap TSVs reduce the overall parasitic capacitance and the overall energy loss compared to the conventional circular TSV or conventional coaxial TSV.
Keywords
air gaps; three-dimensional integrated circuits; 3DIC; air gap based coaxial TSV; conventional circular TSV; conventional coaxial TSV; energy loss; parasitic capacitance; Air gaps; Through-silicon vias; Air-Gap; Coaxial; TSV; Three-Dimensional ICs; Through Silicon Via;
fLanguage
English
Publisher
ieee
Conference_Titel
Design and Test Symposium (IDT), 2013 8th International
Conference_Location
Marrakesh
Type
conf
DOI
10.1109/IDT.2013.6727102
Filename
6727102
Link To Document