• DocumentCode
    680265
  • Title

    Effects of climate factors on bacillary dysentery epidemic in Harbin City, China

  • Author

    Hao Zhang ; Chunpu Zou ; Fengfeng Shao ; Guozheng Li

  • Author_Institution
    Sch. of Basic Med., Shanghai Univ. of Traditional Chinese Med., Shanghai, China
  • fYear
    2013
  • fDate
    18-21 Dec. 2013
  • Firstpage
    308
  • Lastpage
    330
  • Abstract
    Bacillary dysentery is an important infectious disease caused by shigella dysenteriae. Here, we characterized the dynamic temporal trend of bacillary dysentery, and identified climate-related risk factors and their roles in bacillary dysentery transmission in Harbin city, China. A database is integrated monthly climate factors and incidence rates of Harbin city from 1986 to 1990. In this study, three consecutive months´ climate data are used to predicted one month´s incidence. One popular algorithm, The Least Absolute Shrinkage and Selectionator operator (lasso), a shrinkage and selection method for linear regression is applied to select related climate factors and build prediction model. Through this study, monthly accumulative precipitation, daily maximum precipitation, the daily maximum precipitation of one month before and monthly mean minimum temperature were found to result in the highest relative risk for bacillary dysentery.
  • Keywords
    cellular biophysics; diseases; microorganisms; regression analysis; bacillary dysentery transmission; climate data; daily maximum precipitation; identified climate-related risk factors; infectious disease; lasso; least absolute shrinkage-and-selectionator operator; linear regression; monthly accumulative precipitation; monthly mean minimum temperature; prediction model; shigella dysenteriae; Cities and towns; Diseases; Humidity; Predictive models; Temperature; Wind speed; Bacillary dysentery; Lasso; climate factors; linear regression; prediction model;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Bioinformatics and Biomedicine (BIBM), 2013 IEEE International Conference on
  • Conference_Location
    Shanghai
  • Type

    conf

  • DOI
    10.1109/BIBM.2013.6732701
  • Filename
    6732701