DocumentCode
680374
Title
Fabrication of silicon carbide semiconductor core optical fibre preform
Author
Ghosh, Sudip ; Paul, M.C. ; Das, S.
Author_Institution
Fibre Opt. & Photonic Div., Central Glass & Ceramic Res. Inst., Kolkata, India
fYear
2013
fDate
13-15 Dec. 2013
Firstpage
1
Lastpage
4
Abstract
This work describes for the first time about the development of silicon carbide (SiC) semiconductor doped optical fibre preform made by modified chemical vapor deposition (MCVD) process followed by solution doping technique. Quantum dot level nano crystals are observed after thermal annealing of the preform samples at 1400°C temperature. We explained the formation of silicon carbide semiconductors within silica glass based optical fibre preform thermodynamically followed by material characterization through EPMA, SEM, TEM, and XRD to investigate material properties of the preform samples. Such kind of optical fibre preforms will be suitable for making of silicon carbide semiconductor doped optical fibres which may open the door to use itself in the field of non-linear optical devices.
Keywords
X-ray diffraction; annealing; chemical vapour deposition; electron probe analysis; glass; nanostructured materials; optical fibre fabrication; preforms; scanning electron microscopy; semiconductor doping; semiconductor quantum dots; silicon compounds; transmission electron microscopy; wide band gap semiconductors; EPMA; SEM; SiC; TEM; XRD; modified chemical vapor deposition process; quantum dot level nano crystals; silica glass based optical fibre preform; silicon carbide semiconductor core optical fibre preform; solution doping; temperature 1400 degC; thermal annealing; Aluminum; Carbon; Glass; Heat treatment; Optical fibers; Preforms; Silicon carbide; Chemical vapor deposition; Defect centers; Optical fibre preform; Quantum dot; Silicon carbide and Aluminum carbide;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave and Photonics (ICMAP), 2013 International Conference on
Conference_Location
Dhanbad
Print_ISBN
978-1-4799-2176-8
Type
conf
DOI
10.1109/ICMAP.2013.6733527
Filename
6733527
Link To Document