Title :
Investigating the mechanical effect of the solder joint thickness with simulation
Author :
Garami, Tamas ; Krammer, Oliver
Author_Institution :
Dept. of Electron. Technol., Budapest Univ. of Technol. & Econ., Budapest, Hungary
Abstract :
In this paper, the effect of the various thickness of the solder joint between the SMD (Surface Mound Device) chip resistor and the PCB (Printed Circuit Board) pad on the mechanical strength was investigated with FEM (Finite Element Method) simulation. The mechanical effect was studied for different solder alloys too; lead-free and lead-bearing alloys were compared together. A FEM program was used to calculate and simulate the response for the mechanical loading. The solder joint of a 0603 (1.6 × 0.8 mm) size SMD resistor was investigated while the mentioned thickness was increased from 12 μm up to 130 μm. The simulation used non-linear material parameters for the solder joint. In the finite element analysis, we examined the stress response that was induced by shear load. The solution of the Anand model showed that a thicker solder joint results in a less mechanical stress.
Keywords :
finite element analysis; printed circuit testing; resistors; solders; surface mount technology; Anand model; FEM; PCB; SMD resistor; chip resistor; finite element analysis; finite element method; lead-bearing alloys; lead-free alloys; mechanical effect; mechanical loading; mechanical strength; mechanical stress; nonlinear material parameters; printed circuit board; shear load; size 0.8 mm; size 1.6 mm; size 12 mum to 130 mum; solder joint thickness; surface mound device; Finite element analysis; Lead; Materials; Semiconductor device modeling; Soldering; Stress; FEM simulation; Solder joint; mechanical stress; stand-off height;
Conference_Titel :
Design and Technology in Electronic Packaging (SIITME), 2013 IEEE 19th International Symposium for
Conference_Location :
Galati
DOI :
10.1109/SIITME.2013.6743686
